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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6716 Issued Date : 1996.02.01 Revised Date : 2001.05.28 Page No. : 1/2
HBU406
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBU406 is designed for use in TV Horizontal output and Switching applications.
Features
* High Breakdown Voltage
Absolute Maximum Ratings
* Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 C Junction Temperature ..................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) .................................................................................... 60 W * Maximum Voltages and Currents (Ta=25C) VCEO Collector to Emitter Voltage ................................................................................... 200 V VEBO Emitter to Base Voltage ............................................................................................. 6 V IC Collector Current ............................................................................................................. 7 A IB Base Current .................................................................................................................... 4 A
Characteristics (Ta=25C)
Symbol *BVCEO ICES IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 *hFE3 Min. 200 25 30 10 Typ. Max. 5 1 1 1.2 125 Unit V mA mA V V Test Conditions IC=100mA, IB=0 VCE=400V VEB=6V, IC=0 IC=5A, IB=0.5A IC=5A, IB=0.5A IC=500mA, VCE=5V IC=2A, VCE=5V IC=5A, VCE=5V
*Pulse Test : Pulse Width 380us, Duty Cycle2%
Classification Of hFE2
Rank Range A 30-45 B 35-85 C 75-125
HBU406
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
Marking :
A D B E C
HSMC Logo Part Number Date Code
Spec. No. : HE6716 Issued Date : 1996.02.01 Revised Date : 2001.05.28 Page No. : 2/2
Product Series Rank
H I G 4 P M 3 2 1 N K
Style : Pin 1.Base 2.Collector 3.Emitter
O
3-Lead TO-220AB Plastic Package HSMC Package Code : E *:Typical
DIM A B C D E G H
Inches Min. Max. 0.2197 0.2949 0.3299 0.3504 0.1732 0.185 0.0453 0.0547 0.0138 0.0236 0.3803 0.4047 *0.6398 -
Millimeters Min. Max. 5.58 7.49 8.38 8.90 4.40 4.70 1.15 1.39 0.35 0.60 9.66 10.28 *16.25 -
DIM I K M N O P
Inches Min. Max. *0.1508 0.0295 0.0374 0.0449 0.0551 *0.1000 0.5000 0.5618 0.5701 0.6248
Millimeters Min. Max. *3.83 0.75 0.95 1.14 1.40 *2.54 12.70 14.27 14.48 15.87
Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931
HBU406
HSMC Product Specification

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